In our first Foundry Files video blog, we sat down with Gary Patton, GLOBALFOUNDRIES CTO and SVP of Worldwide R&D, to give us his perspective on EUV lithography, why it’s important, the challenges to overcome, and its significance in advancing leading edge technology.
To learn more about GF breakthrough innovations in EUV, join us at the SPIE Advanced Lithography Conference from February 21-25, 2016, in San Jose, California.
Dr. Gary Patton is the Chief Technology Officer and Senior Vice President of Worldwide Research and Development at GLOBALFOUNDRIES. He is responsible for GF’s semiconductor technology R&D roadmap, operations, and execution.
Prior to joining GF, Dr. Patton was the Vice President of IBM’s Semiconductor Research and Development Center – a position that he held for eight years. During that time, he was responsible for IBM’s semiconductor R&D roadmap, operations, execution, and technology development alliances, with primary locations in East Fishkill, New York, Burlington, Vermont, Albany Nanotech Research Center in Albany, New York, and Bangalore, India. He was also a member of the select IBM Corporate Growth & Transformation Team.
Dr. Patton is a well-recognized industry leader in semiconductor technology R&D with over 30 years of semiconductor experience. During his career at IBM, he has held a broad set of executive and management positions in IBM’s Microelectronics, Storage Technology, and Research Divisions, including positions in technology and product development, manufacturing, and business line management.
Dr. Patton received his B.S. degree in electrical engineering from UCLA and his M.S. and Ph.D. degrees in electrical engineering from Stanford University. He is a Fellow of the IEEE and a member of the IEEE Nishizawa Medal Awards Committee. He has co-authored over 70 technical papers and given numerous invited keynote and panel talks at major industry forums on technology and industry issues.