In our journey at Fab 8, we’ve made great strides. Last year, we crossed a significant milestone – moving from construction to full-scale production, and driving to ramp the early-access version of our 14nm FinFET technology (14LPE) to volume production.
This year we have driven a steady march of execution with our performance-enhanced 14LPP technology. We kicked off the year with the exciting news that our 14nm technologies will be fueling some of the most powerful compute and graphics applications, with AMD’s new lineup of discrete graphic processors.
Continuing this momentum, we delivered strong technical results by reaching mature yields in high volume production on multiple products, introducing several new products for major customers—including complex chips with very large die—and achieving a 100 percent track record of yielding first-time-right silicon and aggressively ramping production to support product launches.
It is our relentless focus on execution that is now allowing our customers to differentiate their products, and to bring them to market on time. Another great example is the latest news from AMD, who recently gave a performance preview of its next-generation “Zen” processor core. Just like AMD’s newly launched Polaris graphics chips, this processor is built on GLOBALFOUNDRIES’ 14LPP process technology. It is the powerful combination of AMD’s design expertise and GF’s 14nm FinFET technology that allows Zen to deliver a landmark increase in processor performance over previous generations.
I am pleased to report that customer traction remains strong across a number of segments, with more than 20 active engagements in the mobility, consumer electronics, and high-performance computing sectors. And the interest is not just from traditional foundry customers, but also from companies that are looking to take advantage of the capabilities provided by our FX-14™ ASIC offering for cloud networking, wireless base station, compute, and storage applications.
Looking ahead, we are committed to delivering leading-edge technology platforms, while enhancing our 14nm FinFET technology, to enable new opportunities and secure a strong foundation for future success, including 7nm next generation technology.