Foundry Files Blog

Enabling the Next Generation of Packaging Innovation

  • By: Communications
  • April 26, 2012
  • Category: Technology

Today we announced a significant milestone on the road to enabling 3D stacking of chips for next-generation mobile and consumer applications. At our Fab 8 campus in Saratoga County, NY, we recently began installation of a special set of production tools to create Through-Silicon Vias (TSVs) in semiconductor wafers processed on our leading-edge 20nm technology platform.

In the following video, we sat down with David McCann, senior director of packaging R&D, to get a better sense of the significance of this announcement, as well as GLOBALFOUNDRIES’ overarching strategy to enable next-generation packaging technologies.

Back To Top